Direct 3D microprinting of highly conductive gold structures via localized electrodeposition

Directly 3D-printed metal microstructures could enable hybrid micromanufacturing, combining conventional micromanufacturing with additive (µAM). The microstructure’s material properties, including the electrical resistivity, are of decisive importance for a wide range applications in microelectronics, high-frequency communication, and biomedical engineering. In this work, we present room-temperature process µAM gold structures based on local electrodeposition. We demonstrate control electrodeposition by regulating precursor species supply rate through air pressure reaction potential. 3D printed complex microscale characterized resistivity developing devices integrated four-point probe measurement capability. Additionally, copper microwires, building previously shown process, resistivity. near-bulk values 65 nΩ·m (about 2.5 times higher than bulk) 19 (only 10% wires, respectively, without post-treatment. Microstructural analysis wires revealed dense deposit free voids. Finally, pre-patterned substrate, paving way to which is combined existing techniques.